Pan Pacific Symposium Conference Proceedings


A NOVEL ADHESIVE FOR IC PACKAGING

Authors: Michael Kropp, PhD. and Andrew Behr
Company: 3M Electronics
Date Published: 2/25/2005   Conference: Pan Pacific Symposium


Seika Machinery, Inc.

Abstract: IC package manufacturers employ a variety of polymeric materials in their manufacturing process, including adhesives. Within the package, adhesives may be used for a range applications including die, stiffener, heat sink and substrate bonding. Adhesives are available in numerous delivery formats including pastes and films. Paste adhesives may be either dispensed or printed. Screen and stencil printing are two methods of pattern printing. There are several commercially available patternable adhesives for IC packaging applications.

This paper describes a new, 100% solids patternable adhesive that makes use of ultraviolet (UV) irradiation to B-stage the adhesive after dispensing. Once bonding is performed, a secondary thermal cure cycle yields fully crosslinked, void free bonds. The adhesive may be modified to be either tacky or non-tacky after the UV irradiation B-staging step. The cured adhesive provides high adhesive strength that is resistant to moisture and stable at high temperature.

The adhesive has been used successfully in a number of packaging and assembly applications including die and stiffener attaching. A comparison of the different bonding process will be reviewed. Studies on optimization of print quality and UV B-staging parameters will also be discussed. This new 100% solids, B-stage, pattern printable paste adhesive offers significant process and performance advantages over traditional IC packaging adhesives.

Key words: adhesive, ultraviolet (UV), B-stage, screen print, die attach.



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