A NOVEL ADHESIVE FOR IC PACKAGINGAuthors: Michael Kropp, PhD. and Andrew Behr
Company: 3M Electronics
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
This paper describes a new, 100% solids patternable adhesive that makes use of ultraviolet (UV) irradiation to B-stage the adhesive after dispensing. Once bonding is performed, a secondary thermal cure cycle yields fully crosslinked, void free bonds. The adhesive may be modified to be either tacky or non-tacky after the UV irradiation B-staging step. The cured adhesive provides high adhesive strength that is resistant to moisture and stable at high temperature.
The adhesive has been used successfully in a number of packaging and assembly applications including die and stiffener attaching. A comparison of the different bonding process will be reviewed. Studies on optimization of print quality and UV B-staging parameters will also be discussed. This new 100% solids, B-stage, pattern printable paste adhesive offers significant process and performance advantages over traditional IC packaging adhesives.
Key words: adhesive, ultraviolet (UV), B-stage, screen print, die attach.
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