Pan Pacific Symposium Conference Proceedings


"SEE NO DEFECT, SPEAK NO DEFECT, HEAR NO DEFECT" A PRODUCT QUALITY DEVELOPMENT PROGRAM BASED ON RANDOM DPA

Author: Eric Fremd
Company: Brocade Communications Systems
Date Published: 2/25/2005   Conference: Pan Pacific Symposium


Abstract: Destructive physical analysis (DPA) is a suite of rigorous material analysis tests that are both nondestructive and destructive. It includes: optical inspection, X-ray analysis, ion chromatography (IC) testing, cross-section analysis, and mechanical testing. Results are measured to general industry standards such as IPC-A-610C, IPC-A-600G and IPC/WHMA-A-620. Random DPA is performed as a quality development program throughout the product development lifecycle.

DPA is performed at the earliest prototype stages, at mid-level development and at final production verification test (PVT). During product development, DPA provides an additional opportunity to realize or see defects that may not be caught by other quality methods. The DPA product quality development program results in permanent corrective actions. These actions drive optimization and reengineering of product design, incoming materials and manufacturing processes.

Key words: DPA, Quality Inspection, Quality Program.



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