Pan Pacific Symposium Conference Proceedings


Authors: Shen-Li Fu, Ph.D. et al.
Company: I-Shou University
Date Published: 2/25/2005   Conference: Pan Pacific Symposium

Abstract: With a forecast of 23.3% growth in revenue compared with that of 2002, the total amount of IC packaging revenue will be US$3,239million in 2003. Taiwan packaging industry is ranked number one in the world. The status of packaging industry in Taiwan is discussed in this presentation. The research and development of packaging technology are carried out by both research institutes and by industry. Among the institutes devoting to packaging technology development, ITRI (Industrial Technology Research Institute) plays a very important role.

The market trends of packaging industry in Taiwan are also discussed. The influences of the IC manufacturing industry and the system applications on packaging technology and packaging industry are described. High-density assembly using flip chip technology and the fast growing flat panel display using chip-on-film are two examples. Besides, the efforts of training college graduate students, with majors in science and engineering other than electrical engineering, into packaging industry is introduced, also.

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