THE STATUS OF PACKAGING INDUSTRY IN TAIWANAuthors: Shen-Li Fu, Ph.D. et al.
Company: I-Shou University
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
The market trends of packaging industry in Taiwan are also discussed. The influences of the IC manufacturing industry and the system applications on packaging technology and packaging industry are described. High-density assembly using flip chip technology and the fast growing flat panel display using chip-on-film are two examples. Besides, the efforts of training college graduate students, with majors in science and engineering other than electrical engineering, into packaging industry is introduced, also.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.