Pan Pacific Symposium Conference Proceedings


Author: Alec J. Babiarz
Company: Asymtek
Date Published: 2/25/2005   Conference: Pan Pacific Symposium

Abstract: The new advance in applying underfill by utilizing jetting techniques enables the use of more flip chip die sizes in compact packages. Jetting underfill as well as other semiconductor packaging fluids is a paradigm shift in the method of applying adhesives versus traditional needle dispensing. In the past many types of pumps were used to dispense fluids but the common denominator was pushing fluid through a dispensing needle. Jetting eliminates the use of needles, thereby solving all needle related problems and opens new innovative techniques to apply adhesives.

Also, new ideas for underfilling large flip chips, making zero (0) width fillets if desired are available if designers are willing to think differently about package design. This paper will cover the new theory and process of jetting capillary and no-flow underfill, a new underfill method for large die which minimizes flow out time, and a review of the basics of underfilling.

Key words: Jet, Underfill, Dispensing, Flip Chip.

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