Pan Pacific Symposium Conference Proceedings


PARIDIGM SHIFT IN APPLYING UNDERFILL

Author: Alec J. Babiarz
Company: Asymtek
Date Published: 2/25/2005   Conference: Pan Pacific Symposium


Abstract: The new advance in applying underfill by utilizing jetting techniques enables the use of more flip chip die sizes in compact packages. Jetting underfill as well as other semiconductor packaging fluids is a paradigm shift in the method of applying adhesives versus traditional needle dispensing. In the past many types of pumps were used to dispense fluids but the common denominator was pushing fluid through a dispensing needle. Jetting eliminates the use of needles, thereby solving all needle related problems and opens new innovative techniques to apply adhesives.

Also, new ideas for underfilling large flip chips, making zero (0) width fillets if desired are available if designers are willing to think differently about package design. This paper will cover the new theory and process of jetting capillary and no-flow underfill, a new underfill method for large die which minimizes flow out time, and a review of the basics of underfilling.

Key words: Jet, Underfill, Dispensing, Flip Chip.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819