PARIDIGM SHIFT IN APPLYING UNDERFILLAuthor: Alec J. Babiarz
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
Also, new ideas for underfilling large flip chips, making zero (0) width fillets if desired are available if designers are willing to think differently about package design. This paper will cover the new theory and process of jetting capillary and no-flow underfill, a new underfill method for large die which minimizes flow out time, and a review of the basics of underfilling.
Key words: Jet, Underfill, Dispensing, Flip Chip.
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