FLEXURAL STRENGTH OF BGA SOLDER JOINTS WITH ENIG SUBSTRATE FINISH USING 4-POINT BEND TESTAuthors: Anurag Bansal, Sam Yoon, and Vadali Mahadev
Company: Altera Corporation
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
The devices were electrically monitored for the duration of the tests, along with the load, displacement, and PCB strain. The tests were performed at three different strain rates. Results show that the high strain rate 4-point bend test is capable of replicating the brittle fracture failure modes observed in PCB assembly operations. The PCB strain to failure and the failure mode were found to be strongly dependent on the strain rate.
A significant outcome of this work is the determination of the PCB strains which, if exceeded, could pose a substantial risk of brittle fracture in assembly, test, shipping, and handling operations.
Key words: BGA, ENIG, brittle, fracture, bend, flex.
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