Pan Pacific Symposium Conference Proceedings


MINIATURE SYSTEMS DRIVE CHIP-SCALE ASICS

Author: Dale Lee
Company: Manufacturers' Services Ltd.
Date Published: 1/25/2000   Conference: Pan Pacific Symposium


Abstract: The compression of product development cycles has lead to the increased usage of concurrent engineering and the co-location of manufacturing and test engineering personnel with the development engineering team. These practices have resulted in the reduction of product development cycles from years to a year or even a few months.

Miniaturization of products and further integration of functionality onto silicon combined with outsourcing of manufacturing and design services has created a shortage of critical skills at the OEM to develop new products that are reliable, manufacturable, testable and cost-efficient . This is due in part to the reduction or elimination of manufacturing and test engineering organizations and the advancement of technology. The lack of necessary skills has driven OEMs to work with critical suppliers and service providers to build development teams for the design and development of new products. These teams may extend beyond first-level component suppliers and service providers.

Iomega Corporation realized that a traditional design methodology would not meet the requirements of the program for component packaging, PCB design and PCA assembly. Therefore, Iomega formed a multi-level supply chain team for the development of a new thin removable media disk drive. This paper will address the multi-tier supply chain chip scale ASIC development process used in the development of miniature removable disk drive products.

Key words: Supply Chain Management, Supply Chain Design, CSP, BGA, DFM.



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