LEAD-FREE SOLDER INSPECTION WITH X-RAYAuthor: Friedhelm W. Maur
Company: FEINFOCUS GmbH
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
Long accepted as a way to inspect quality and process control of Ball Grid Array (BGA) solder joints, X-ray inspection can help the electronics industry in the transition to impeccable lead-free assemblies. X-ray is the only means of detecting internal hidden structures of packages and assemblies, providing insight into a variety of solder defects, such as voiding, poor wetting, opens, delamination, and trace defects. The use of X-ray inspection for defect prevention allows manufacturers to correct problems before they become field failures.
With its unique capabilities, X-ray technology will play a crucial role in the inspection of lead-free solder joints. While other inspection modalities such as AOI and SEM allow for views of the perimeter of solder joints, X-ray is the only means of detecting internal defects of packages and assemblies.
This paper will show examples of possible defects in solder joints using X-ray inspection systems with microfocus X-ray technique and will also provide an overview of available system configurations specially developed for the needs of solder joint inspection.
Key Words: X-ray inspection, lead-free electronics manufacturing, BGA, voiding, solder joints.
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