LEAD-FREE PRODUCT AND PROCESS CONVERSION PHASE III - REFLOW PROCESS OPTIMIZATION*Author: Hana Hsu et al.
Company: Mitac International Corp.
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
Symmetrical stack-up was designed into the layer structure to reduce PCB warpage. Major Lead-Free reflow control variables such as ramping rate, soaking temperature, soaking time, dwelling time, peak temperature, reflow environment, and cooling rate were factored into design of experiment (DOE) by Taguchi method to optimize the processes. The testing boards with different thickness and various surface finishes of Immersion Ag and Ni /Au were used. Package and solder joint quality responses will be correlated to physical properties, PCB warpage, solder diameter and circularity, standoff, wetting, and microstructure. A rationale and optimized reflow profile by systematic DOE approach is achieved.
Keywords: Lead-Free, Reliability, Taguchi method, Solder joint Reliability.
*This study is a work of YAMI team in Taiwan for knowledge sharing and facilitation of technology evolution. No product endorsement, business implication, and working preference in any forms are associated with this publication.
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