Pan Pacific Symposium Conference Proceedings


SELECTIVE SOLDER PASTE DEPOSITION RELIABILITY TEST RESULTS

Author: Bob Wettermann
Company: BEST, Inc
Date Published: 2/25/2005   Conference: Pan Pacific Symposium


Abstract: The rapid assimilation of Ball Grid Array (BGA) and other Area Array Package technology in the electronics industry is due to the fact that this package type allows for a greater I/O count in a smaller area while maintaining a pitch that allows for ease of manufacture. While the original assembly process has proven to be fairly trouble-free, replacement of Area Array package devices after the assembly process can be much more difficult.

When reworking BGA and area array devices there continues to be discussion related to the technical merits of using solder paste versus flux only. While using flux only during attachment is the BGA rework technique of choice due to its simplicity, the solder paste printing attachment process is supported by data which indicates that it is a more reliable rework process compared to its flux only attachment counterpart.

While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs. Data from a recent reliability study comparing the two techniques with a focus on a new stenciling technique is presented.

Key words: BGA, rework, stencil, solder paste.



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