SELECTIVE SOLDER PASTE DEPOSITION RELIABILITY TEST RESULTSAuthor: Bob Wettermann
Company: BEST, Inc
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
When reworking BGA and area array devices there continues to be discussion related to the technical merits of using solder paste versus flux only. While using flux only during attachment is the BGA rework technique of choice due to its simplicity, the solder paste printing attachment process is supported by data which indicates that it is a more reliable rework process compared to its flux only attachment counterpart.
While there have been several studies comparing these two attachment methods, this study highlights the effect of rework technique on the electrical characteristics and reliability of reworked BGAs. Data from a recent reliability study comparing the two techniques with a focus on a new stenciling technique is presented.
Key words: BGA, rework, stencil, solder paste.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.