EFFECT OF BAKING TIME AND TEMPERATURE ON LEAD FREE SECOND LEVEL INTERCONNECT SOLDER JOINT MICROSTRUCTURES, MICROHARDNESS AND IMC MORPHOLOGYAuthors: Norman J. Armendariz and Vasu Vasudevan
Company: Intel Corporation
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
The bulk solder joint and IMC- interface intermetallic compounds that form after SMT reflow and bake reliability testing were evaluated in terms of their thickness and morphology. Moreover, solder joint microstructures were identified and characterized in terms of their bulk solder microhardness.
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