MANUFACTURING OPTIMIZATION AND RELIABILITY OF LARGE SOLDERED DAUGHTER MODULES FOR HIGH PERFORMANCE COMMUNICATION APPLICATIONSAuthors: R. Scott Priore, S. Camerlo, and M. Brillhart
Company: Cisco Systems, Inc
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
The manufacturability optimization evaluation was performed in the following areas:
After the process optimization, long term interconnect reliability was also evaluated through extensive thermal cycling (0 - 100C, 3500 cycles). An FEA model was created and validated using the experimental results. Finally, an acceleration calculation was performed based on the experimental results and the field product life conditions. It was concluded that the modules met all manufacturing and reliability requirements for the targeted product application.
Key words: Module, BGA, Daughter Card.
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