Pan Pacific Symposium Conference Proceedings


DEVELOPMENT OF LOW DIELECTRIC CONSTANT AND LOW DIELECTRIC LOSS TANGENT FILM USED IN A HIGH FREQUENCY RANGE

Author: Taku Fujino
Company: NAMICS Corporation
Date Published: 2/25/2005   Conference: Pan Pacific Symposium


Abstract: Recently, the miniaturization of mounting technology has developed rapidly. Therefore, there is a demand for thinner printed wiring boards (PWBs) with higher circuit density. At the same time, data transmission speed in communication equipment has shifted to the giga bps range, while the frequency of the semiconductor chips for these electronic devices is becoming higher. Since the performance of the substrate material for PWBs is important, their improvement is required.

Epoxy resins have been used for PWBs in the past, and have excellent electrical properties under high humidity and high temperatures as a resin of substrate materials. These epoxy resins must have good performance, practical use and be cost effective. However, even with epoxy resins with good performance, the degradation of the electrical properties (such as a dielectric constant and dielectric loss tangent) occurs at higher frequencies.

We have developed a low dielectric constant and low dielectric loss tangent material for PWBs by using modified phenol resin as the hardener of epoxy resin. From this research, we have successfully obtained a low dielectric constant and low dielectric loss tangent material compared to the conventional epoxy resin. The thickness of the films can be controlled in the range of 2micrometers to 90micrometers by using micro gravure coating method and slot die coating method.

Key words: low dielectric constant material, low dielectric loss tangent material, printed wiring boards, Epoxy resin, micro gravure coating method, slot die coating method.



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