Pan Pacific Symposium Conference Proceedings


40GBS HIGH I/O PIN COUNT SURFACE MOUNTABLE CERAMIC PACKAGE

Author: Hui Wu et al.
Company: Big Bear Networks, Inc.
Date Published: 2/25/2005   Conference: Pan Pacific Symposium


Abstract: OC-768 (40Gbs) systems are being developed and deployed for communication infrastructures given the projected bandwidth requirements. It incurs technological advances in every forefront of product development. For package development, the bandwidth required for first time extends into the millimeter wave region. Neither traditional microwave module nor lower speed high pin-count package technology can meet disparate needs of stringent signal integrity required for 40Gbs interconnect and large number IOs required for low-speed signals.

A high pin count 40Gbs surface mountable multi-layer LTCC package is thus developed for OC-768 applications by combining features of traditional microwave module and high pin count package to meet joint requirements of 40Gbs and low-speed I/Os. In the design, various microwave transmission line topologies and transitions are engineered to facilitate this approach, and to meet the overall design objectives of electrical, thermal, environmental and manufacturing requirements.

Overall the module is an integrated design of signal integrity, EMI/EMC, power and ground planes management, thermal management, assembly processes and reliability criteria. The completed module is qualified and has been in volume production.

Key words: 40Gbs, high pin count, LTCC package, surface mountable.



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