Pan Pacific Symposium Conference Proceedings


RF & MICROPROCESSOR CIRCUITS FOR MEMS SENSOR PACKAGING

Author: Thomas Jorgensen et al.
Company: Zensys A/S
Date Published: 2/25/2005   Conference: Pan Pacific Symposium


Abstract: In the recent years wireless Home Automation products like lightning, thermostats blinds/drapes and appliance control, energy management, access control and building automation has reached the market. With the combination of highly integrated RF and micro-processor platform and micro electromechanical systems (MEMS) the wireless sensors and actuators of tomorrow will be ultra cheap and small and open new yet un-thought markets.

These ultra small sensors silently and wirelessly collect data, for instance monitoring light, temperature and many other factors. The complex integration of MEMS, processing circuitry, RF communication circuitry and energy source results in a unique and self-contained system that not only detects its environment but also has the capability of actively change it.

The high integration of the sensors requires single chip implementation of the MEMS sensors and the RF and micro-processor circuitry. With the use of 3-D assembly and MEMS new standards are set for the product assembly and new materials.

This paper will cover some design considerations of a low cost wireless Home Environment (HE) sensor including RF and micro-processor circuitry, MEMS sensors, the interconnections and packaging. The low cost is crucial if such small sensors should penetrate the marked.

Key words: Wireless, Home Automation, MEMS, Sensor.



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