THERMAL RC - NETWORKS FOR ACCURATE MODELING OF SYSTEM-IN-PACKAGEAuthors: Kimmo Kaija and Eero Ristolainen
Company: Tampere University of Tech.
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
One reason, why SiP has not yet conquered the electronics industry, is the increased complexity of the design. Especially, the thermal design will require much more attention compared to traditionally packed components . A SiP might contain multiple heat sources in a small volume, surrounded by materials with the low thermal conductivity. This structure can increase the heat dissipation density, shorten the life span of the device, and might endanger the functionality of the system or cause permanent damage. To conclude, the thermal challenges increase the need to verify the design with simulations or prototypes before manufacturing.
Keywords: 3D stacked packaging, thermal modeling, compact thermal model (CTM) synthesis, and System-in-Package (SiP).
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