MULTI-OBJECTIVE OPTIMIZATION IN MCM PLACEMENTAuthors: Ching-Mai Ko, Yu-Jung Huang, and Shen-Li Fu
Company: I-Shou University
Date Published: 2/25/2005 Conference: Pan Pacific Symposium
For reliability considerations, the design methodology focuses on the placement of the power dissipating chips to achieve uniform thermal distribution. For route-ability consideration, the total wire length minimization is estimated by Steiner tree approximation method. For substrate area consideration, the area is estimated by minimum area contains all chips. The cost function is formulated by the weight sum calculation. For design flexibility, different weights can be assigned depending on designer's considerations.
Various methods including iteration, simulated annealing and small perturbation are applied to solve the placement solutions. The results obtained from different solution techniques are further compared. The auto generated optimal placement results are also demonstrated.
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