Pan Pacific Symposium Conference Proceedings


Authors: Ching-Mai Ko, Yu-Jung Huang, and Shen-Li Fu
Company: I-Shou University
Date Published: 2/25/2005   Conference: Pan Pacific Symposium

Abstract: Placement of multiple dies on an MCM substrate is a difficult combinatorial task in which multiple criteria need to be considered simultaneously to obtain a true multi-objective optimization. Our design methodologies consider multi-objective component placement based on thermal reliability, routing length and chip area criteria for multi-chip module. The purpose of the multi-objective optimization placement is to enhance the system performance, reliability and reduce the substrate area by obtaining an optimal cost during multi-chip module placement design phase.

For reliability considerations, the design methodology focuses on the placement of the power dissipating chips to achieve uniform thermal distribution. For route-ability consideration, the total wire length minimization is estimated by Steiner tree approximation method. For substrate area consideration, the area is estimated by minimum area contains all chips. The cost function is formulated by the weight sum calculation. For design flexibility, different weights can be assigned depending on designer's considerations.

Various methods including iteration, simulated annealing and small perturbation are applied to solve the placement solutions. The results obtained from different solution techniques are further compared. The auto generated optimal placement results are also demonstrated.

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