Pan Pacific Symposium Conference Proceedings


EVALUATION OF STACKED DIE PACKAGES USING ACOUSTIC MICRO IMAGING

Author: Janet E. Semmens
Company: Sonoscan, Inc.
Date Published: 2/25/2005   Conference: Pan Pacific Symposium


Abstract: The limited available area and need for greater functionality in small electronic devices, such as cellular phones, has led to the development and implementation of stacked die packages. These packages conserve space and the closer connections in these packages result in higher speed.

As with other microelectronic devices there is a need to be capable of evaluating the packages for internal defects that could adversely affect the operation of the devices or lead to premature failure. AMI is routinely used to evaluate a wide variety of microelectronic devices. The construction of stacked die packages however presents certain challenges for AMI analysis of the devices for internal defects.

This paper will present a brief background on the construction of stacked die packages and examples of analyses using various AMI methods to detect internal features and defects in the packages.

Key words: Acoustic Micro Imaging (AMI), stacked die packages.



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