MANUFACTURING ROBUSTNESS OF CSP ON AN SMT LINEAuthor: Alex Chen
Date Published: 9/12/1999 Conference: SMTA International
In this paper, the assembly process flow, solder paste for different stencil design, manufacturing defects, X-ray inspection results, and ultrasonic characterizations are reported. Optimize process techniques which were learned during the six month assembly of test vehicles are also presented. Also, manufacturing robustness of CSPs were investigated by increasing the placement offset during assembly. Limiting offsets for different CSPs were reported and finally, future activities on assembly process optimization and characterizations were reviewed.
Keywords: electronic assembly, SMT, CSP, fine pitch, microvia technology, BGA
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