WAFER LEVEL BURN-IN & TEST USING SACRIFICIAL METAL AS AN INTERFACE MEDIUMAuthor: John Darling
Company: Delta V Instruments Inc.
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
While a move to wafer level burn-in and test is inevitable, it raises the question, ‘How do we achieve a comprehensive test scenario while ensuring good contact across the wafer surface?’ The use of sacrificial metal (SM) as an interface medium addresses this question by limiting the number of interconnects, so eliminating concerns associated with coefficient of expansion mismatches, planarity issues, and the force required to contact over thirty thousand interface points across the wafer surface.
Key words: burn-in, known good die, KGD, sacrificial metal.
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