WAFER-LEVEL BURN-IN AND TESTAuthor: Steve Steps
Company: Aehr Test Systems
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
Consumers are demanding higher capability portable electronic devices ranging from cellular telephones with built in cameras to PDAs that are miniature computers. Consumers are willing to pay a premium for reduced size and weight. Achieving this reduced size and weight normally requires the use of advanced packaging technologies such as System In Package (SIP) that use multiple bare die.
The reliability of the overall package will be shown to be highly dependent upon the reliability of each of the bare die. The usual method for achieving highly reliable parts is through burn-in to sort out early failures. However, there are very few alternatives for burning-in unpackaged (bare) die. These few alternatives are compared in terms of the cost per burned-in die versus wafer volume. Recent improvements are reviewed that have significantly reduced the cost per die.
Finally, this paper discusses one of the major challenges of WLBT: full wafer contact. Data is shown to demonstrate that full wafer contact not only possible, but can also be very reliable.
Key words: WLBT, KGD, reliability, burn-in, Wafer-Level Burn-in.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.