LEAD-FREE BUMPING AND ITS CHALLENGESAuthor: Y. Zhang et al.
Company: Cookson Electronics, Enthone
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
Both high lead (>85%) and eutectic SnPb bumps have been manufactured by electroplating from chemistries that contain low alpha particle lead in solution. Today, the high lead SnPb bumps are exempted from the WEEE and RoHS directives. Decision has yet to be made with regard to eutectic solder bumps.
In this paper, we will present a few lead-free bump plating processes that are suitable to replace eutectic SnPb. The technical challenges as well as comparisons with regard to SnPb and among these lead-free processes themselves will be discussed.
Key words: flip chip, wafer bumping, electroplating, voiding, tin pest, tin whisker.
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