LEAD-FREE AND TIN-LEAD ASSEMBLY AND RELIABILITY OF FINE PITCH WAFER LEVEL CSPsAuthor: Michael Meilunas et al.
Company: Universal Instruments
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
This paper discusses solder paste printing and flux dipping assembly processes for 0.4 and 0.5mm pitch lead-free WLCSPs and the corresponding assembly results and thermal cyclic reliability obtained. Variables evaluated include reflow ambient, paste type, and stencil design. Reliability is also compared to results for the same components assembled under identical conditions using SnPb solder.
Key words: WLCSP, 0.4mm pitch, lead-free, assembly, reliability.
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