THE DEVELOPMENT OF A LOW COST WAFER LEVEL BUMPING TECHNIQUEAuthor: Mark Whitmore et al.
Company: DEK Printing Machines Limited
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
This paper details work undertaken to combine the benefits of standard stencil printer technology with that of solid solder sphere placement to enable the development of a low cost, flexible system for the bumping of wafer level packages. In addition, an alternative print & reflow technique based on an extrusion concept was also investigated. The two techniques are compared for the bumping of a 0.5mm pitch WL-CSP product. The work undertaken forms part of the European funded IST-2000-30006 "Blue Whale" programme which is concerned with developing next generation wafer level packaging for handheld applications in a LAN environment. Project partners include Philips CFT, Shellcase, Technical University of Berlin, Technical University of Delft and DEK Printing Machines Ltd.
Key Words: Bumping, wafer-level balling, chip scale packaging, ball placement.
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