APPLICATIONS FOR SILICON MICROMACHINING IN ADVANCED DEVICE PACKAGING SCHEMESAuthor: A.A. Chambers
Company: Surface Technology Systems plc
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
This paper describes specific silicon micro-machining processes that have been developed in inductively coupled plasma (ICP) etching systems for a number of these applications. In particular, dry-etching techniques for fabricating through-wafer vias with vertical sidewall profiles, high etching rate and high selectivity to photoresist masks are discussed and contrasted with micro-machining techniques for forming scribe channels and vias with specific dimensional control and predictable sidewall taper angles.
Keywords: DRIE, deep reactive ion etching, micromachining, anisotropic etching, tapered etching, Bosch process
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