LOW COST FLIP CHIP SOLUTIONS, C3 AND BEYONDAuthors: Charles E. Bauer, Ph.D. / Alexander Taran
Company: TechLead / Microelec Assembly
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
Capillary Chip Connection (C3) greatly simplifies flip chip assembly while simultaneously improving reliability, reducing bumping and substrate costs, and expanding metallurgical options for the electrical connection provided. C3 remains compatible with traditional assembly and substrate technologies as well as infrastructure including conventional reflow, thermo-compression reflow assembly on the one hand vis a vis conventional tape and flex circuit technologies on the other hand. In addition, lower cost substrates under evaluation for such applications as RF identification and automotive applications show promise.
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