IWLPC (Wafer-Level Packaging) Conference Proceedings


Author: M. Bartek et al.
Company: Delft University of Technology
Date Published: 10/10/2004   Conference: IWLPC (Wafer-Level Packaging)

Abstract: In this paper, Shellcase WLCSP technology is analyzed for electrical performance and its potential in RF packaging. An equivalent circuit model is developed using parameter extraction from a physical model representing typical package geometries (3.1 x 3.1 mm2, 48 I/Os). Analysis of the results indicates that due to its comparably low electrical parasitics (L = 0.3-1.1 nH), this package is suitable for lowpower RF/microwave applications.

Moreover, intrinsic flexibility of this packaging technology provides novel opportunities for RF enhancements. As the Si substrate when bonded to a glass carrier is mechanically stabilized, it can be thinned or selectively removed to any extent. Full through-substrate trenches provide an effective way of substrate crosstalk suppression. Selective removal of lossy silicon substrate below spiral inductors provides high quality passives. Possibility to implement cavities makes this package type also an attractive option for RF MEMS applications.

Key words: wafer-level packaging, RF packaging, crosstalk suppression, electrical modeling.

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