SHELLCASE-TYPE WAFER-LEVEL PACKAGING SOLUTIONS: RF CHARACTERIZATION AND MODELINGAuthor: M. Bartek et al.
Company: Delft University of Technology
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
Moreover, intrinsic flexibility of this packaging technology provides novel opportunities for RF enhancements. As the Si substrate when bonded to a glass carrier is mechanically stabilized, it can be thinned or selectively removed to any extent. Full through-substrate trenches provide an effective way of substrate crosstalk suppression. Selective removal of lossy silicon substrate below spiral inductors provides high quality passives. Possibility to implement cavities makes this package type also an attractive option for RF MEMS applications.
Key words: wafer-level packaging, RF packaging, crosstalk suppression, electrical modeling.
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