TRENDS IN IC ASSEMBLY AND PACKAGINGAuthors: E. Jan Vardaman and Linda Matthew
Company: TechSearch International, Inc.
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
The drivers for flip chip continue to be performance and pad limited designs, as well as form factor needs. For these applications, almost all are 0.13µm device technologies. High performance logic suppliers such as ASIC, field programmable gate array (FPGA), and microprocessor makers are expanding their use of FCIP. In addition, highend DSPs, graphics ICs, and chip set makers are also increasing shipments of FCIP. Growth rates for solder bumping are expected to increase 48 percent in 2005. This growth is driven by chipset, graphics, and wireless applications.
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