IWLPC (Wafer-Level Packaging) Conference Proceedings


ADVANCED IC PACKAGING MARKETS AND TRENDS

Authors: Sandra Winkler and Steve Berry
Company: Electronic Trend Publications
Date Published: 10/10/2004   Conference: IWLPC (Wafer-Level Packaging)


Abstract: The worldwide IC packaging industry is going through rapid changes, bringing on advanced packaging methods at an increasing pace. This paper examines the IC packaging industry over the next five years and looks at the interplay of advanced packaging methods with mainstream methods.

Following an increase of 14.6 percent in 2002 and 14.9 percent in 2003, IC units should grow nearly 18 percent in 2004. However, ETP believes that unit growth will take a break in 2005. Why the break in 2005? In looking back at the industry’s history, there have never been four consecutive years of high unit growth. However, solid unit growth should return in 2006-2008. As illustrated in Figure 1, demand for ICs will grow from 90.3 billion units in 2003 to 149.2 billion units in 2008 - a compound annual growth rate (CAGR) of 10.6 percent.

Key words: BGA, CSP, WLP.



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