WAFER THINNING WITH THE 3M WAFER SUPPORT SYSTEMAuthor: Carl R. Kessel et al.
Company: 3M Company
Date Published: 10/10/2004 Conference: IWLPC (Wafer-Level Packaging)
The key elements of the support system are a UV curable liquid adhesive and a light-to-heat conversion (LTHC) layer between the glass plate and the adhesive. The liquid adhesive ensures conformity to the front side topography and, after hardening, provides uniform support of the entire wafer area during grinding. Since all areas of the wafer are supported during the grinding process, and the overall compliance of the glass plate-cured adhesive stack is much less than film-based tape systems, wafer cracking is reduced and yields are increased.
The adhesive also protects the wafer edge from chipping and is removed from the wafer surface with residue levels comparable to those seen with conventional backgrinding tapes. The proprietary LTHC layer between the rigid glass support plate and the adhesive allows for removal of the glass plate after grinding.
Key Words: wafer support, backgrinding, thinning, ultrathin, adhesive.
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