IWLPC (Wafer-Level Packaging) Conference Proceedings


WAFER LEVEL MEMS PACKAGING STRATEGIES

Authors: Daniel F. Baldwin, Ph.D.
Company: Georgia Institute of Tech.
Date Published: 10/10/2004   Conference: IWLPC (Wafer-Level Packaging)


Abstract: Micro-electro-mechanical systems packaging can be defined as all the activities or considerations post device fabrication to integrate it with the surrounding system. In addition to the packaging requirements for microelectronics, MEMS require a physical interface with the operating environment in order to perform sensing or actuating functions. The physical interfaces can take many forms or combination of forms including fluidic (or microfluidic), pneumatic, magnetic, electromagnetic, optic, high frequency RF, thermomechanical, electromechanical, thermal, and/or mechanical.

Thisphysical interface is exactly what traditional microelectronics packaging attempts to issolate the device from due to inherent sensitivity of the ICs. The net result is large footprint, high cost, high complexity MEMS packaging solutions. These are some of the many reasons wafer level packaging of MEMS is gaining momentum in the industry.

Wafer level packaging (WLP) presents a unique opportunity for the packaging of MEMS devices. It leverages many standard microelectronics packaging techniques and introduces a number of wafer level bonding techniques making it one of the most attractive and cost effective MEMS packaging strategies for emerging microsystems. Like microelectronics versions, wafer level MEMS packaging accomplishes all packaging elements at the wafer level thereby amortizing all the more expensive unit packaging steps over a multitude of devices keeping the net cost low.

Another advantage of WLP is that the package is microsystem dimension resulting in a minimum size and weight packaging solution. WLPs have the advantage of having the smallest possible package footprint, i.e., the same size as the die itself. This means that WLP offers a potential solution for size critical components that are often found in many handheld consumer electronics products. This paper reviews some of the recent advances in WLP of MEMS.



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