MECHANICAL AND THERMAL CHARACTERIZATION OF LEAD FREE SOLDER
Authors: Arv Sinha and Joe Kuczynski Company: IBM Server Group Development Date Published: 9/26/2004
Abstract: The industry move toward lead free materials in electronic devices has opened a new array of various lead free materials whose mechanical and thermal properties are not fully characterized. The European Union law which bans all leaded components in electronic packaging goes into effect July 1, 2006. In this paper, we have characterized two lead free materials with respect to mechanical and thermal reliability. Mechanical and thermal properties were evaluated as a function of temperature and future work on low cycle fatigue is outlined.