SMTA International Conference Proceedings


Authors: Dongkai Shangguan, Ph.D.
Company: Flextronics
Date Published: 9/26/2004   Conference: SMTA International

Abstract: As we move closer to 2006, leading OEMs and EMS companies worldwide are getting ready for environmental compliance under WEEE and RoHS. The global effort is moving towards lead-free implementation and is going beyond lead-free. A number of changes are taking place in the worldwide lead-free landscape to ensure a smooth transition. Efforts are being shifted from R&D to implementation, from developmental labs to the manufacturing floor, and from low volume to high volume in most product categories, and the focus is being shifted from technology, to engineering and operations. Volume manufacturing for lead-free PCB assembly is a complex undertaking for the industry and for each manufacturer, and managing the compatibility issues is critical to a smooth transition to lead-free PCB assembly.

This paper will review the key compatibility issues involved, and the strategy for the transition from an EMS/ODM perspective. For RoHS compliance, supply chain compliance and assurance management are a complex undertaking that needs the entire industry to work on. Design for the environment (DfE) and recycling are the ultimate solutions to environmental issues posed by the ever-increasing volume of electronic products. Strategies and methodologies for RoHS compliance management, and product end-of-life management through recycling, will also be discussed.

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