SMTA International Conference Proceedings


UPDATE OF GLOBAL TRENDS IN LEAD-FREE SOLDERING

Authors: John Lau and Katrina Liu (Beijing Normal Univers.)
Company: Agilent Technologies, Inc.
Date Published: 9/26/2004   Conference: SMTA International


Abstract: Global trends regarding lead-free soldering and technology are investigated in this study. Emphasis is placed on costs, regulations, definitions, designs, materials, processes, tests, inspections, and reliability of components, printed circuit boards (PCBs), tin whiskers, and solder joints.

Lead-free is here to stay! Either you jump on the bandwagon or are left behind [1 - 111]. Since February 13, 2003, lead-free has been a law in the European Union (EU) [18]. The implementation date is July 1, 2006. That means, starting from that date, all EEE (electrical and electronic equipment), except those with exemptions [18], cannot be made in and shipped to the EU if they have lead content. At the time being, China is writing her own lead-free law, which will be published in the Fall of 2004. Their implementation date is also July 1, 2006.

Recently, packages such as plastic ball grid array (PBGA), chip scale package (CSP), flip chip, and wafer level chip scale package (WLCSP) have been very popular for consumer, computer, and communication (3C) products. Most of these packages use solder as an interconnect material, thus they are affected by the lead-free regulations. In this study, the impacts of lead-free on PBGA, CSP, flip chip, WLCSP, and plastic quad flat pack (PQFP) are examined. In [105, 106], the global trends of lead-Free soldering have been presented and they will not be repeated herein, but they will be updated accordingly.

Key words: Lead-free, solder joint reliability, tin whisker



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