SMTA International Conference Proceedings


Authors: Frank Grano and Felix Bruno
Company: Sanmina-SCI Technology
Date Published: 9/26/2004   Conference: SMTA International

Abstract: As the use of SMT components has increased and the use of through-hole component has decreased (but not eliminated) the use of Intrusive reflow has become a method of soldering the limited quantity of PTH components. Intrusive reflow uses the SMT process to solder the Through-hole components. Solder paste is applied to the PCB, the Through-hole component is inserted into the board, and then it is reflowed along with the SMT components.

This process has been used with a lead-based process with success. As the transition to a lead-free soldering process continues there is a need to extend this to a lead-free process. This paper will look into the criteria needed to use the intrusive process with lead-free solders, namely the SAC alloy. It will start with the same rules that have been established for lead-based soldering and then determine if these same rules can be used for lead-free soldering.

The soldering results will based on the amount of hole fill and will also look at the formation of the top and bottom side solder fillets. The intent of this paper will not be to qualify any of the components used in terms of temperature ratings but rather it will concentrate on the soldering of the components.

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