INTRUSIVE REFLOW USING A LEAD-FREE PROCESSAuthors: Frank Grano and Felix Bruno
Company: Sanmina-SCI Technology
Date Published: 9/26/2004 Conference: SMTA International
This process has been used with a lead-based process with success. As the transition to a lead-free soldering process continues there is a need to extend this to a lead-free process. This paper will look into the criteria needed to use the intrusive process with lead-free solders, namely the SAC alloy. It will start with the same rules that have been established for lead-based soldering and then determine if these same rules can be used for lead-free soldering.
The soldering results will based on the amount of hole fill and will also look at the formation of the top and bottom side solder fillets. The intent of this paper will not be to qualify any of the components used in terms of temperature ratings but rather it will concentrate on the soldering of the components.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.