SURFACE MOUNT CHALLENGES WITH LEAD-FREE REFLOWAuthors: Prawin Paulraj and Norman J Armendariz
Company: Intel Corporation
Date Published: 9/26/2004 Conference: SMTA International
The lowest peak temperature and time above liquidus (TAL) are experimentally determined using designed experiments. Limits are identified for these variables, which in turn define the processing window. The resulting profile is then compared against a traditional eutectic profile, to determine the impact of beat rate and delta temperature, followed by a discussion on power cost adder due to the higher reflow temperature associated with LF processing.
Key Words: Lead-Free, Reflow Soldering, Process Window.
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