SMTA International Conference Proceedings


PROCESSING HEAT-SENSITIVE COMPONENTS IN LEAD-FREE AND OTHER CONDITIONS

Authors: B. Lewis, P. Chouta, A. Singer et al.
Company: Cookson Electronics Inc.
Date Published: 9/26/2004   Conference: SMTA International


Abstract: Reflow temperatures are increasing due to lead-free adoption at the same time that we are assembling devices with more heat-sensitive components - optoelectronic modules, displays, MEMS and complex ICs. This paper reviews technologies to manage these heat sensitive components and describes a new technology to protect these sensitive components and allow them to be processed under normal reflow, wave and rework conditions.

Keywords: Pb-free, heat-sensitive, cooling components



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