SMTA International Conference Proceedings


LEAD-FREE SOLDER PASTE EVALUATION

Author: Michael Havener / Robert Farrell
Company: Benchmark Electronics
Date Published: 9/26/2004   Conference: SMTA International


Abstract: The European Union’s deadline to ban lead in electronic products is quickly approaching. To meet the challenges of lead-free soldering, a method to evaluate the performance of lead-free solder pastes will be explored. Identifying the optimal water-soluble and no-clean chemistries is the objective of this testing. Existing tin-lead pastes will also be evaluated as a comparison and to determine if the lead-free chemistries can meet or exceed tin-lead performance.

The evaluation process will start with the selection of materials and test vehicle followed by three test phases to down select the candidate pastes. Testing will evaluate printing performance, solder spreadability and solder joint formation.



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