BOARD-LEVEL THERMAL DESIGN MAPS FOR HQFPAuthor: Ching-Bai Hwang
Company: CCL / Industrial Technology Re
Date Published: 1/25/2000 Conference: Pan Pacific Symposium
An experimentally validated computational fluid dynamics model is utilized to proceed the thermal design for HQFP on board. The die size, board construction, power density and the ambient air velocity are vital performance factors. Based on the thermal performance maps of HQFP packages for various board-level conditions, system designers could easily and more accurately predict the heat rise when using the package in a system during the early design phase. This is also the active service provided by the contract packaging supplier.
Key Words: QFP, thermal enhancement, thermal modeling, numerical simulation, thermal design rule.
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