Pan Pacific Symposium Conference Proceedings


Author: Ching-Bai Hwang
Company: CCL / Industrial Technology Re
Date Published: 1/25/2000   Conference: Pan Pacific Symposium

Abstract: In this paper thermal features of HQFP on FR4 boards with different control variables are discussed. These control variables include the die size, board constructions, and the thermal load on board. Thermal paths are further analyzed to make out heat dissipation mechanism. From the view of heat flux projection, the major heat dissipates to PCB and hence the junction to ambient thermal resistance is significantly dominated by the carrier board. Therefore except the value of thermal resistance acquired from the standard measurement, more information about the performance trend on various applications should make known to the system designer when using the packages.

An experimentally validated computational fluid dynamics model is utilized to proceed the thermal design for HQFP on board. The die size, board construction, power density and the ambient air velocity are vital performance factors. Based on the thermal performance maps of HQFP packages for various board-level conditions, system designers could easily and more accurately predict the heat rise when using the package in a system during the early design phase. This is also the active service provided by the contract packaging supplier.

Key Words: QFP, thermal enhancement, thermal modeling, numerical simulation, thermal design rule.

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