SMTA International Conference Proceedings


MICROSCOPIC MODEL OF ELECTRONICS ASSEMBLY PROCESS USING NEXT EVENT SIMULATION

Authors: Ketan Shah and Kenneth Ebeling
Company: North Dakota State University
Date Published: 9/26/2004   Conference: SMTA International


Abstract: Historically researchers have studied and developed computer models of the electronics assembly process. Next event simulation has been employed in macroscopic models to predict the throughput and bottlenecks of a printed circuit board assembly system. Microscopic simulation models have also been developed for individual operations of the assembly process such as screen printing, pick and place, reflow oven, inspection, etc.

For the most part, these detailed models of individual process steps have been developed for the purpose of relating the frequency and type of the defects to the operating conditions of a particular workstation. Some researchers have worked on optimizing the process parameters for one process step in surface mount electronics manufacturing. To date, very little work has been done to develop a detailed model that is capable of accurately predicting assembly line throughput as a function of the type and frequency of the defect caused by the operating conditions of the integrated assembly process.

This paper characterizes and models the factors which affect the entire surface mount electronics manufacturing process. The operating parameters of each process step are used to predict the total cost of producing any board defined by a computer aided design (CAD) file. The computer model also predicts the frequency and type of defect that appears at end of the manufacturing process in order to predict the distribution of circuit board flow time. The simulation model uses these predictions to search for the optimum operating conditions to minimize the sum of production and rework costs.

Key words: Simulation modeling, electronics manufacturing, process characterization.



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