3D X-RAY TESTS AND ANALYSES OF LEAD-FREE PBGA (PLASTIC BALL GRID ARRAY) PACKAGE SOLDER JOINTS
Author: J. Lau et al. Company: Agilent Technologies, Inc. Date Published: 9/26/2004
Abstract: The effects of lead-free solder paste (Sn3wt%Ag0.5wt%Cu) and lead-free solder ball (Sn4wt%Ag0.5wt%Cu) of a 1156-pin PBGA (plastic ball grid array) package on their solderjoint x-ray inspection are investigated. Emphasis is placed on the determination of the difference (shift) of the x-ray measurement parameters (e.g., solder diameter and solder thickness) between the lead-free and tin-lead (Sn37wt%Pb) solder joints. Also, the threshold adjustment values for the lead-free solder thickness, depending on the slice-location, are recommended and discussed.