DOES PCB PAD FINISH AFFECT VOIDING LEVELS IN LEAD-FREE ASSEMBLIES?Authors: David Bernard and Keith Bryant
Company: Dage Precision Industries
Date Published: 9/26/2004 Conference: SMTA International
This paper will evaluate reasons for the increase in voiding, explore the different PCB pad finishes in use for lead-free and the amount of voiding produced by a controlled soldering process using these surface finishes. With the use of advanced technology including automated digital x-ray measurements, the total amount of voiding, void size and location will be measured and compared.
The summary will contrast the findings of these tests and measurements; conclusions could then be drawn on the preferred PCB pad finishes for lead-free assembly. Those seeking to improve printed circuit assembly process control and reduce failures can use the methodology in this paper to keep voiding within acceptable levels.
Key words: Lead-free, voiding, pad finish, x-ray inspection
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