INSPECTION OF LEAD-FREE SOLDER JOINTS ON PRINTED CIRCUIT ASSEMBLIES USING AUTOMATED INSPECTION TECHNIQUESAuthors: Andrew Pollock
Date Published: 9/26/2004 Conference: SMTA International
This paper is intended to aid in the transition from tin-lead to lead-free solder with reference to automated inspection methods. Specifically, the paper discusses many of the general solder joint differences observed within lead-free assemblies and discusses how this will affect Automated Optical Inspection (AOI) and Automated X-ray Inspection (AXI) in terms of the capability to perform lead-free component and solder joint inspection. The paper further discusses the utilisation of a Lead-Free Qualification Matrix to gather data to ensure that lead free assemblies can be effectively and reliably inspected using current automated inspection techniques.
Key words: Lead free, test, automated inspection, AOI, AXI.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.