X-RAY INSPECTION OF AREA ARRAY PACKAGES USING TIN-LEAD AND LEAD-FREE SOLDERSAuthors: David Geiger, Todd Castello, Dr. Dongkai Shangguan
Date Published: 9/26/2004 Conference: SMTA International
There is some speculation that inspection of hidden solder joints may be impacted by the use of lead-free solders. The reason for this speculation is the absence of lead from the solder alloy thereby decreasing the density of the solder. The density of 63Sn/37Pb solder is around 8.41g/cc and the density of Sn/Ag/Cu lead-free alloy is around 7.39g/cc. This is about a 12% difference in the densities.
The question is how a 12% difference in the density affects the X-ray inspection of the hidden solder joints.
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