IMBEDDED COMPONENT / DIE TECHNOLOGY: A HIGH RELIABILITY PACKAGING SOLUTIONAuthor: Jason B. Gjesvold
Company: Soldering Technology Intnl.
Date Published: 9/26/2004 Conference: SMTA International
Imbedded Component / Die Technology improves form factor by increasing component-to-substrate ratios, enabling smaller CCA’s or clearing board surface area for redundant systems to increase system reliability in mission critical applications. Flexible interconnects in the form of wire bonds from component-to-component or component-tosubstrate, encapsulated in a vibration-dampening material, allow for reliable use in demanding mechanical shock and vibration environments. The use of Imbedded Component / Die Technology can dramatically improve reliability and also improve form factor.
Key words: Wire Bonds, Conductive Adhesives, Organic Substrate, Reliability, Hi-Rel, 3-Dimensional, Cavities, Thermal Core, Imbedded Components, Bare Die
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