SMTA International Conference Proceedings


IMBEDDED COMPONENT / DIE TECHNOLOGY: A HIGH RELIABILITY PACKAGING SOLUTION

Author: Jason B. Gjesvold
Company: Soldering Technology Intnl.
Date Published: 9/26/2004   Conference: SMTA International


Abstract: Increased reliability requirements coupled with progressively reduced assembly size and weight constraints necessitate the evolution of technology for assembling printed circuit boards. Imbedded Component / Die Technology (IC/DT) promises to advance electronics packaging to the next level in the 21st century by transforming 2-Dimensional component assembly and placement into 3-Dimensions. Rather than placing components on the surface of the circuit board, Imbedded Component / Die Technology places components onto or near a rigid, thermally conductive core utilizing multi-level cavities. By eliminating all external component level packaging, the total number of electrical and mechanical failure opportunities is reduced and system reliability is greatly increased. The use of bare die and thin/thick film components reduces the overall mass, weight, and circuit card assembly (CCA) size.

Imbedded Component / Die Technology improves form factor by increasing component-to-substrate ratios, enabling smaller CCA’s or clearing board surface area for redundant systems to increase system reliability in mission critical applications. Flexible interconnects in the form of wire bonds from component-to-component or component-tosubstrate, encapsulated in a vibration-dampening material, allow for reliable use in demanding mechanical shock and vibration environments. The use of Imbedded Component / Die Technology can dramatically improve reliability and also improve form factor.

Key words: Wire Bonds, Conductive Adhesives, Organic Substrate, Reliability, Hi-Rel, 3-Dimensional, Cavities, Thermal Core, Imbedded Components, Bare Die



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