ELECTROLESS NICKEL / ELECTROLESS PALLADIUM / IMMERSION GOLD PROCESS FOR MULTI-PURPOSE ASSEMBLY TECHNOLOGYAuthors: Kuldip Johal and Hugh Roberts et al.
Company: Atotech USA Inc.
Date Published: 9/26/2004 Conference: SMTA International
Testing of eutectic Sn-Pb solder joints demonstrates the impact of thermo-cycling (500 cycles of -55°C to +125°C) on the Ni/Pd/Au surface in comparison to other selective finish methodologies (i.e. electroless nickel/gold and organic solderability preservatives). Similarly, ball shear testing of the SAC-alloy solder joints shows the impact of thermal aging (+150°C for 1000 hours) on the Ni/Pd/Au surface, compared to the performance of the more conventional electrolytic nickel/electrolytic gold process under the same test conditions. The overall reliability of solder ball attachment is characterized by both mechanical ball shear test results and visual inspection.
Key words: Nickel, Palladium, Gold, BGA, SAC-alloy
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