SHOCK-INDUCED FAILURE PREDICTION MODEL FOR FINE-PITCH BGAs AND CSPsAuthor: Pradeep Lall et al.
Company: Auburn University
Date Published: 9/26/2004 Conference: SMTA International
Model predictions have been validated with experimental data. Results show that models with smeared properties can predict transient-dynamic response of board assemblies in drop-impact, fairly accurately. High-speed data acquisition system has been used to capture in-situ strain, continuity and acceleration data in excess of 1 million samples per second.
Ultra high-speed video at 40,000 fps per second has been used to capture the deformation kinematics. Component types examined include - plastic ball-grid arrays, tape-array BGA, QFN, and C2BGA. Model predictions have been correlated with experimental data. Impact of experimental error sources on model correlation with experiments also has been investigated.
Keywords: BGA, modeling, strain, relative-displacement.
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