CONFORMAL COAT IMPACT ON AREA ARRAY PACKAGE SOLDER JOINT RELIABILITYAuthors: Keith Kirchner and David Nelson
Company: Raytheon Company
Date Published: 9/26/2004 Conference: SMTA International
The study investigates the impact of silicone and Parylene conformal coatings, epoxy underfill materials and a silicone sealant on a variety of area array packages while being subjected to thermal cycling. A test vehicle was created specifically for the investigation. The test vehicles were exposed to 2000 thermal cycles from -40o to 95o Centigrade with 10 minute dwell periods at each temperature extreme and a maximum temperature ramp rate of 10o Centigrade per minute.
The test vehicles were subsequently exposed to 500 additional cycles from -55o to 125o Centigrade. Continuous electrical monitoring, visual inspection and cross section techniques were used to analyze the test vehicles.
Key words: area array, solder joints, conformal coat, underfill and reliability.
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