FLIP-CHIP UNDERFILL AND FLUX RESIDUE INTERACTION IN A Pb-FREE PROCESSAuthors: Brian Toleno, Ph.D. et al.
Company: Henkel Loctite Electronics
Date Published: 9/26/2004 Conference: SMTA International
The leading Pb free alloy candidates are the different SnAgCu formulations (often-abbreviated SAC) recommended by NEMI  in the United States and IRTI in the EU . The Sn/Ag/Cu eutectic system has a melting point of 217oC, significantly higher than the 183oC melting point of eutectic Sn/Pb alloy. These new alloys increase the peak reflow temperature from 220oC up to 240 or 260oC, a factor that affects material performance. This study deals with one aspect of Pb free processing for array assemblies: underfill/flux adhesion.
Key Words: Pb-Free, Underfill, flux residue.
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