SMTA International Conference Proceedings


ASSEMBLY PROCESS AND PACKAGE DESIGN FOR HIGH PERFORMANCE FLIP CHIP

Authors: Jon G. Aday, Danny T. Brady, David McCann
Company: Amkor Technology
Date Published: 9/26/2004   Conference: SMTA International


Seika Machinery, Inc.

Abstract: New substrate and silicon technologies are making the migration to flip chip packaging more complicated. Several substrate suppliers are developing and bringing new technologies to the market place to enable higher density and faster clock speeds, but these new technologies are also harder to package since they are typically thinner. In addition as the silicon technologies begin to utilize more Low K material sets and the die sizes move to over 19mm square, the silicon becomes less forgiving and the robustness of the package is affected adversely.

The other main factors driving the design and material choices are Pb Free and green packaging. The reliability performance of all new packaging products must be able to withstand the Moisture Sensitivity Level 3 (MSL3) with a 260C reflow. This requirement is more difficult and makes the material selection more complicated. This paper will focus on the proper choices to make for substrate technology as well as the assembly materials and process for a robust high performance flip chip package.

Keywords: Flip chip, Green, Large Die



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