ASSEMBLY PROCESS AND PACKAGE DESIGN FOR HIGH PERFORMANCE FLIP CHIPAuthors: Jon G. Aday, Danny T. Brady, David McCann
Company: Amkor Technology
Date Published: 9/26/2004 Conference: SMTA International
The other main factors driving the design and material choices are Pb Free and green packaging. The reliability performance of all new packaging products must be able to withstand the Moisture Sensitivity Level 3 (MSL3) with a 260C reflow. This requirement is more difficult and makes the material selection more complicated. This paper will focus on the proper choices to make for substrate technology as well as the assembly materials and process for a robust high performance flip chip package.
Keywords: Flip chip, Green, Large Die
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.