A NEW HIGH PERFORMANCE ORGANIC SUBSTRATEAuthors: R. Gorrell, D. Le-Huu, S. Qu, D. Banks, D. Hanson
Company: 3M Company
Date Published: 9/26/2004 Conference: SMTA International
Simultaneously, market conditions have driven a price-competitive approach, even in high-end applications. The cost of use of the package must be lower even if advanced materials are used. A new, more cost effective, organic flip chip package substrate technology has been developed, prototyped, qualified, and is being ramped into production. This laminated substrate technology uses an engineered composite dielectric combined with advanced fabrication techniques to produce very high-density organic substrates.
The dielectric material boasts a Dk of 3.2 and a dissipation factor of 0.002 (at 9.3GHz). Standard design groundrules of the technology allow:
The technology has been used to fabricate 45mm by 45mm test vehicles having die of 19mm by 19mm with more than 8000 total I/O. In this paper, we will discuss the construction materials, process technology, substrate reliability, assembly results, and package reliability using this new technology.
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